The following electronic loads can be used to understand the electronic environment (12V system) that automotive electronics face.
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Overvoltage experiment
18V experiment: Simulated generator regulator failure, causing the generator output voltage to rise, higher than the normal voltage. In the experiment, the module temperature was 20 degrees lower than the module maximum temperature, and the applied voltage was 18V for 60 minutes.
24V experiment: Simulate the situation of auxiliary starting. In the experiment, the module temperature was applied at room temperature, applying a voltage of 24 V for a duration of 60 seconds.
Superimposed AC voltage experiment
Simulate residual AC power in DC power supply (distribution system).
Experimental conditions: Upp = 1 V, 4V; the internal resistance of the power supply is 50 mΩ~100 mΩ; the waveform frequency range is 50 Hz ~ 20 KHz; the sweep waveform type is triangle or logarithm; the sweep duration is 120 s The number of sweeps is 5 times.
Power supply voltage ramp down and ramp up
Simulate the gradual discharge and charging of the battery. The applied voltage to the module, at a rate of 0.5 ± 0.1 V/min, reduces the supply voltage from USmax to 0 V and then from 0 V to USmax.
Supply voltage interruption
Instantaneous drop in supply voltage: Simulates the effects of typical fuse blows in other circuits. Note that the rise and fall times of the test pulse are ≤ 10 ms.
Voltage dip reset performance: The module's reset performance for verifying voltage dips, suitable for devices with reset function. The supply voltage was reduced from USmin to 0.95 USmin at a rate of 5% for 5 s and then increased to USmin for at least 10 s and functional testing. The voltage is then reduced to 0.9 USmin, etc., and continues at a 5% gradient of USmin until it drops to 0V, and then the voltage is raised to USmin.
Module Startup Features: Verify the characteristics of the DUT at startup and after startup.
Reverse voltage: The ability of the module to resist reverse connection of the battery when using an auxiliary starting device. With a reverse voltage of 14V, it is applied to all relevant inputs of the module for a period of 60 seconds.
Ground offset: If the module has two or more power supply lines, verify the reliable operation of the module. (The power ground of the module may not match the reference point at which the input signal of the module is grounded).
Open circuit test
Single-wire open circuit: The circuit condition in which the analog module is disconnected. Open circuit time: 10 s ± 10%; open circuit impedance: ≥ 10MΩ.
Multi-line disconnection: When the module is suddenly disconnected by multiple lines, the functional status can meet the specified requirements. Open circuit time: 10 s ± 10%; open circuit impedance: ≥ 10MΩ. For multiple connector devices, each possible connection should be tested.
Short circuit protection: The input and output circuits of the analog device are shorted.
Signal circuit: All relevant input and output terminals of the module are connected to USmax and ground in sequence for 60 seconds.
Load circuit: The module is connected to the power supply and the load circuit is in working condition. All electronic protection outputs should be able to withstand short-circuit currents and return to normal operation after the short-circuit current is cut off. All typical fuse protection outputs should be able to withstand short-circuit currents and return to normal operation after fuse replacement. The unprotected output can be damaged by the test current.
(Insulation) Withstand voltage: Ensure the insulation withstand voltage of the dielectric. Overvoltage causes an electric field to leak current between module components, which may have a negative impact on insulation performance. (Inspect the insulation material to withstand the high voltage generated by disconnecting the inductive load).
Insulation resistance: The minimum impedance necessary to ensure the current between the module's insulated circuit and the conductive components. It is used to verify the insulation properties of the system and materials.
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