Technically, the main factor driving the development of LED applications is the improvement of chip light efficiency. Industry expert and general manager of Shenzhen Lehman Optoelectronics Technology Co., Ltd. Li Mantie told reporters that the light efficiency of LED chips has been continuously improved recently, and the 1W high-power products supplied by the market have reached more than 100lm/W.
Packaging technology is another important factor, although it is not obvious for improving LED light efficiency, but it is closely related to the reliability of LED. Zhang Yanwei, vice president of research and development at China Micro-Optical Electronics (Weifang) Co., Ltd. said that the difference in packaging technology directly affects the quality of LEDs. Good packaging and heat dissipation technology can make LEDs work below 60 °C junction temperature and have a lifetime of more than 50,000 hours. The poor packaging technology will shorten the LED life by more than half. "90% of LED efficacy depends on the luminous efficiency of the chip, 10% depends on the package structure and the excitation efficiency of the phosphor; LED reliability is 30% depends on the chip, 70% depends on the packaging process, packaging material, package structure and package management LED heat dissipation is 50% depending on the chip structure, 50% depends on the package heat dissipation structure design and heat sink material selection." Li Mantie concluded.
In the field of LED lighting, which is widely concerned in the industry, advances in packaging technology are particularly important. At present, the improvement of chip light efficiency makes the efficiency of some high-efficiency LED street lamps reach 80 lm/W or more, which has the advantage of energy saving, and its reliability and service life need to rely on packaging technology to further improve. Li Mantie said that the current bottleneck of LED street lights is not light efficiency, but in the light decay and reliability, the package of high-power LEDs for street lamps plays a key role in the light decay and reliability of LED street lamps.
Chen Hesheng, president of Anhui Zerun Optoelectronics Co., Ltd., believes that for LED street lamps, the packaging industry can do limited work in improving light efficiency. It is more dependent on the advancement of chip technology; it is improving stability and reliability. Sexuality, consistency, etc. are very important (more on process control), because LED devices are used in street lighting applications, and any solution needs to be applied to series-parallel technology, which leads to hundreds of street lamps. In the device, as long as one device has a problem, it will affect the current and voltage thresholds in the original design, which will affect the working state of the whole lamp, making the LED's claimed 10- to 15-year service life become empty talk. Therefore, he believes that in this sense, the control of the failure rate of high-power LED devices must be very strict, which is the top priority of the packaging industry.
Need to strengthen the key mechanism research basic materials and heat dissipation technology in the gradual improvement of key mechanisms still need to strengthen the past, the factors that restrict the development of LED packaging technology are considered to exist mainly in the following three aspects: First, the key packaging materials, such as substrate materials, organic The performance of glue (silica gel, epoxy resin) and phosphor needs to be improved; secondly, the heat dissipation problem of high-power LED packaging technology has not been completely solved; the third is that the package structure should be innovative for different applications. At present, has the domestic LED packaging industry made significant progress in these areas? "Basic materials and heat dissipation technologies are gradually improving, but the improvement is not obvious. The current cost-effectiveness of LED packaging products is more dependent on the main raw materials. --- The cost-effectiveness of LED chips; the innovation of the application-oriented package structure is not obvious, and it is more manifested in the improvement of the process to meet the application requirements. At present, the packaging and application have not yet reached the realm of full integration. Chen Hesheng said. Therefore, he believes that since 2009, the domestic LED industry's progress in the main indicators of packaging technology has become more of a qualitative change, and there has not been a breakthrough in qualitative change.
Li Mantie said that with the improvement of the package structure design and the use of a large number of new heat dissipation materials, the light attenuation control and reliability improvement of the LED package level has reached a new level. However, he believes that the research and mastery of the key mechanisms of LED packaging technology by domestic enterprises is not enough, and the accumulation of independent intellectual property rights is insufficient. He believes that the domestic LED packaging industry needs to pay more attention to key packaging materials, including high-performance epoxy resin, high-performance silica gel, new heat-dissipating materials, new fluorescent materials, and new brackets. He told reporters that Lehman Optoelectronics therefore established the Lehman Optoelectronic Materials R&D Center at China University of Geosciences, and together with the Ph.D. group in the field of materials chemistry to study the key mechanisms of packaging materials technology, and accumulated a series of patented technologies.
At present, the LED application market is continuing to grow rapidly, and packaging companies are expanding their production capacity to meet market demand. However, in this market development opportunity, enterprises can only gain more research and investment in packaging key technologies and achieve more breakthroughs in order to obtain sustainable development.
Packaging technology is another important factor, although it is not obvious for improving LED light efficiency, but it is closely related to the reliability of LED. Zhang Yanwei, vice president of research and development at China Micro-Optical Electronics (Weifang) Co., Ltd. said that the difference in packaging technology directly affects the quality of LEDs. Good packaging and heat dissipation technology can make LEDs work below 60 °C junction temperature and have a lifetime of more than 50,000 hours. The poor packaging technology will shorten the LED life by more than half. "90% of LED efficacy depends on the luminous efficiency of the chip, 10% depends on the package structure and the excitation efficiency of the phosphor; LED reliability is 30% depends on the chip, 70% depends on the packaging process, packaging material, package structure and package management LED heat dissipation is 50% depending on the chip structure, 50% depends on the package heat dissipation structure design and heat sink material selection." Li Mantie concluded.
In the field of LED lighting, which is widely concerned in the industry, advances in packaging technology are particularly important. At present, the improvement of chip light efficiency makes the efficiency of some high-efficiency LED street lamps reach 80 lm/W or more, which has the advantage of energy saving, and its reliability and service life need to rely on packaging technology to further improve. Li Mantie said that the current bottleneck of LED street lights is not light efficiency, but in the light decay and reliability, the package of high-power LEDs for street lamps plays a key role in the light decay and reliability of LED street lamps.
Chen Hesheng, president of Anhui Zerun Optoelectronics Co., Ltd., believes that for LED street lamps, the packaging industry can do limited work in improving light efficiency. It is more dependent on the advancement of chip technology; it is improving stability and reliability. Sexuality, consistency, etc. are very important (more on process control), because LED devices are used in street lighting applications, and any solution needs to be applied to series-parallel technology, which leads to hundreds of street lamps. In the device, as long as one device has a problem, it will affect the current and voltage thresholds in the original design, which will affect the working state of the whole lamp, making the LED's claimed 10- to 15-year service life become empty talk. Therefore, he believes that in this sense, the control of the failure rate of high-power LED devices must be very strict, which is the top priority of the packaging industry.
Need to strengthen the key mechanism research basic materials and heat dissipation technology in the gradual improvement of key mechanisms still need to strengthen the past, the factors that restrict the development of LED packaging technology are considered to exist mainly in the following three aspects: First, the key packaging materials, such as substrate materials, organic The performance of glue (silica gel, epoxy resin) and phosphor needs to be improved; secondly, the heat dissipation problem of high-power LED packaging technology has not been completely solved; the third is that the package structure should be innovative for different applications. At present, has the domestic LED packaging industry made significant progress in these areas? "Basic materials and heat dissipation technologies are gradually improving, but the improvement is not obvious. The current cost-effectiveness of LED packaging products is more dependent on the main raw materials. --- The cost-effectiveness of LED chips; the innovation of the application-oriented package structure is not obvious, and it is more manifested in the improvement of the process to meet the application requirements. At present, the packaging and application have not yet reached the realm of full integration. Chen Hesheng said. Therefore, he believes that since 2009, the domestic LED industry's progress in the main indicators of packaging technology has become more of a qualitative change, and there has not been a breakthrough in qualitative change.
Li Mantie said that with the improvement of the package structure design and the use of a large number of new heat dissipation materials, the light attenuation control and reliability improvement of the LED package level has reached a new level. However, he believes that the research and mastery of the key mechanisms of LED packaging technology by domestic enterprises is not enough, and the accumulation of independent intellectual property rights is insufficient. He believes that the domestic LED packaging industry needs to pay more attention to key packaging materials, including high-performance epoxy resin, high-performance silica gel, new heat-dissipating materials, new fluorescent materials, and new brackets. He told reporters that Lehman Optoelectronics therefore established the Lehman Optoelectronic Materials R&D Center at China University of Geosciences, and together with the Ph.D. group in the field of materials chemistry to study the key mechanisms of packaging materials technology, and accumulated a series of patented technologies.
At present, the LED application market is continuing to grow rapidly, and packaging companies are expanding their production capacity to meet market demand. However, in this market development opportunity, enterprises can only gain more research and investment in packaging key technologies and achieve more breakthroughs in order to obtain sustainable development.
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