Cree launches low-base dislocation 4H silicon carbide epitaxial wafer

Cree has announced the availability of its latest low-base dislocation (LBPD) 100mm 4H silicon carbide epitaxial wafer, which is available now.

Cree pointed out that the total basal dislocation density of the epitaxial drift layer of the low basal dislocation material is less than 1 cm-2, and the basal dislocation capacity causing the Vf shift is less than 0.1 cm-2. Cree said that the launch of this new low-base dislocation material further demonstrates Cree's long-term commitment and innovation in silicon carbide material technology.

Silicon carbide is a high-performance semiconductor material widely used in the production of lighting, power devices and communication devices, including light-emitting diodes (LEDs), power conversion devices, and RF power transistors for wireless communications.

John Palmour, CTO of Power Technology and Radio Frequency (RF), said: "The development of silicon carbide bipolar devices has long been subject to forward voltage attenuation caused by basal plane dislocations. Materials can be used in high-voltage bipolar devices such as insulated gate bipolar transistors (IGBTs) and turn-off thyristors (GTOs) and increase the stability of these devices. This latest achievement helps eliminate the commercialization of hysteretic high-power devices. Obstruction."

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