The eight-inch wafer-level LED aluminum nitride package chip jointly developed by Zhongshan Science Research Institute and TSMC will be publicly exhibited at the Taiwan International Lighting Technology Exhibition from March 18.
According to the Chinese Academy of Sciences, the eight-inch wafer-level LED metal nitride substrate is the first in the world. In the past, Taiwan relied on a 4.5-inch aluminum nitride chip produced in Japan, and the 8-inch process efficiency was three times that of 4.5-inch, which is expected to break the Japanese monopoly substrate process. The situation of technology.
According to the Chinese Academy of Sciences, the eight-inch wafer-level LED metal nitride substrate is the first in the world. In the past, Taiwan relied on a 4.5-inch aluminum nitride chip produced in Japan, and the 8-inch process efficiency was three times that of 4.5-inch, which is expected to break the Japanese monopoly substrate process. The situation of technology.
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