The thermal characteristics of LEDs have an important influence on the optical and electrical properties of LEDs. Thermal resistance and junction temperature are the main thermal characteristics of LED2. Thermal resistance refers to the thermal resistance between the PN junction and the surface of the housing, that is, the ratio of the temperature difference along the heat flow path to the power dissipated on the channel. The junction temperature refers to the temperature of the PN junction of the LED.
Methods for measuring LED junction temperature and thermal resistance generally include: infrared micro-imager method, spectroscopy method, electrical parameter method, photothermal resistance scanning method, and the like. The surface temperature of the LED chip is measured by an infrared temperature measuring microscope or a miniature thermocouple as the junction temperature of the LED, and the accuracy is insufficient.
The commonly used electrical parameter method is to use the characteristic that the forward voltage drop of the LEDPN junction is linear with the PN junction temperature, and the junction temperature of the LED is obtained by measuring the difference of the forward voltage drop at different temperatures.
Methods for measuring LED junction temperature and thermal resistance generally include: infrared micro-imager method, spectroscopy method, electrical parameter method, photothermal resistance scanning method, and the like. The surface temperature of the LED chip is measured by an infrared temperature measuring microscope or a miniature thermocouple as the junction temperature of the LED, and the accuracy is insufficient.
The commonly used electrical parameter method is to use the characteristic that the forward voltage drop of the LEDPN junction is linear with the PN junction temperature, and the junction temperature of the LED is obtained by measuring the difference of the forward voltage drop at different temperatures.
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