In the field of display technology, Micro LED and Mini LED can be described as two hot concepts of recent speculation. Some insiders pointed out that these two new technologies are even better than OLED in some technical aspects. It can be said that the prospects of Micro LED and Mini LED can be period.
As far as Micro-LED is concerned, the industry now agrees with a statement - "very difficult 500 days", that is, from now on, there is still a year and a half, after a year and a half to verify whether Micro-LED can really go The market is moving towards commercialization.
However, many people in the industry pointed out that Micro LED will have a qualitative improvement of image quality and is the next generation of revolutionary display technology. The person in charge of Lianchuang Optoelectronics has said that Mini LED is only a transitional product in the display field, and it will definitely be Micro LED in the future.
Compared with Micro LED, in theory, Mini LED technology is less difficult, easier to mass-produce, and can develop a large number of LCD backlight market, and the product economy is better. According to industry estimates, if the LCD panel is designed with Mini LED backlight, the price is only 6~80% for OLED TV panels, but the brightness and image quality are similar to those of OLED, and the power saving efficiency is higher.
Mini LED as the "spot outpost" of Micro LED, up to the upstream chip companies Jingyuan Optoelectronics, Huacan Optoelectronics and Sanan Optoelectronics, down to the midstream package of Lianchuang Optoelectronics, Ruifeng Optoelectronics, etc. are actively deployed.
When it comes to Mini LED, in fact, Jingyuan Optoelectronics has done a relatively early stage in Greater China. Epistar has begun production of Mini LEDs, and high-end LCD TVs and smartphones are expected to be the first devices to be used as backlights.
And another domestic chip giant, Huacan Optoelectronics, has already ranked second in the domestic industry in terms of chip scale. In the context of the popularity of Mini LEDs, Huacan Optoelectronics has accelerated its layout. It is understood that Huacan Optoelectronics Mini LED chip has been supplied to large international customers in small quantities. With the decline in the cost of Mini LED technology, it is expected to drive the rapid growth of LED chip demand.
Although there are many companies that are “hotâ€, Mini LED has emerged as a concept technology in the near future, and its technology has many difficulties. Huacan Optoelectronics pointed out that the current Mini LED technology has the following characteristics and difficulties:
From the perspective of the process route, the current Mini LEDs all use flip-chip structure, mainly because the flip chip does not need to be wired, which is suitable for the needs of ultra-small space dense packaging, and is suitable for packaging substrates of various materials. The reliability is also obviously improved, and the maintenance cost of the terminal product is reduced. Therefore, in the actual production process, the control of the flip-chip process is extremely important, and at the same time, in the case of small size, the flatness of the welding surface, the design of the electrode structure, and the easy soldering Sexuality and adaptability to welding parameters and package tolerance are the difficulties and priorities of its design.
For the backlight application Mini LED, due to the ultra-thin requirements of the terminal, combined with the cost and control difficulty, the chip is required to achieve a smaller light mixing distance under the wider arrangement of the LED chips, thereby reducing the thickness of the whole machine, so how to The realization of the light-out regulation of the chip and the consistency in the later use process are the key points.
For the display application of RGB Mini LED, in addition to the brightness concentration required by traditional small-pitch chips, the brightness uniformity under small current, low and consistent capacitance characteristics, etc., the use environment and post-maintenance put forward higher requirements for reliability, especially It is the red light chip that needs to transfer the substrate during the flip-chip process. The overall process is complex, and its transfer technology, production yield control and reliability during use are important considerations.
In addition, due to the small size of the Mini LED chip and the requirement for color and color consistency, the Mini LED is generally used in the full-scale mode, and the operation efficiency is low. If the number of products is expected to increase, the application end is in a single product. When the need for more than one hundred K-level chip operation, the efficiency limitation is more obvious, so how to cooperate with the application end to effectively improve the work efficiency is also the current focus.
In any case, under the “unclear†situation of the commercialization of Micro LED, more LED manufacturers are expected to break through the bottleneck of Mini LED technology and open a new chapter in future display technology.
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