Tencent Digital (Zhou Shuo) According to IDC and DIGTIMES data from research organizations, the market demand for servers has grown rapidly in recent years, and the modularized data center will become one of the trends in the development of data centers in the future. It is based on this trend that Tsinghua Tongfang has recently released a modular enterprise-class server product, a rack, a blade, and a storage full-size specification family of products.
Tsinghua Tongfang chose the "modular" server development path, which is the choice after the customer's application is thoroughly analyzed. Tsinghua Tongfang predicts that there will be no standardized products in the future enterprise-class market, but rather customized products that need to respond in a timely manner to customer application requirements. The provider of enterprise application services will be more concentrated. As a small-scale Tsinghua Tongfang in the server market, it needs to first seize the large demand users such as BAT, meet the needs of very large customers in a flexible manner, and take the lead in opening the market. .
Modular server advantages
Modular products have many advantages over traditional servers: centralized power supply, centralized heat dissipation, and centralized management. All components are individually designed as independent “modulesâ€, computing modules, storage modules, cooling modules, and management switch modules, and power supply modules. And so on, the entire system is superposed by several modules. Each module is connected in a hot-pluggable manner. It not only has good integration and scalability, but also greatly improves the convenience of deployment. It is worth mentioning that the Tongfang Modular Product Motherboard is hot-pluggable, which will bring great convenience to user deployment.
Modular servers require good thermal and signal integrity design
Thermal design simulation
The challenge of heat dissipation: Each of the traditional servers has its own fan for heat dissipation, while Tongfang uses a fan wall as a set of fan wall for centralized cooling in the modular server design. This will inevitably lead to heat dissipation challenges. At the beginning of the development of the modular server, Tongfang combined the institutional hardware design, heat dissipation and power device selection. The engineers conducted a series of iterations of the thermal simulation to pass the reasonable circuit board without affecting the EMI. Allocating thermal devices, reasonably increasing openings in the backplane, rationally optimizing the air ducts, and appropriately increasing the open rate of the chassis, ultimately achieving noise reduction and solving the problem of heat dissipation.
Signal transmission node decomposition diagram
Signal Integrity Challenge: Traditional server boards use cable soft-wired. To achieve the modular server design, Tongfang needs to discard the cables and adopt the method of hot-swappable cables. The signals can only be transmitted through the connectors. The signal integrity is greatly challenged. To solve this problem, Tongfang R&D The team took full advantage of SI signal integrity analysis to identify bottlenecks in high-speed signal transmission through signal integrity analysis, formulate breakthroughs and improvement plans, rationally lay out on PCBs, properly shield high-speed differential signals and analog circuits, and use low loss The board is mixed with pressure, and the higher-speed board-turning board connector is properly incorporated into the signal shaping chip to overcome the crosstalk and loss of long-distance high-speed signals, and ultimately the signals are received without distortion and errors.
Although Tsinghua Tongfang is still only a niche brand in the server market, Tongfang people have confidence in the “modular†development ideas and the technical strength of the team. The top five in the industry in three years is their goal.
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