The rapid development of 3G / 4G (LTE) applications is driving the growing wireless infrastructure market. According to the latest research data from iSuppli, the global wireless infrastructure capital investment will reach USD 40.3 billion by 2011. As wireless operators in industrially developed countries begin to deploy faster 4G, and many developing countries such as China and India accelerate the launch of 3G products, it is expected that from this year, capital investment in the 3G / 4G market will continue to grow at least until Year 2014. However, because 3G / 4G systems have stricter requirements on sensitivity and bit error rate than 2G systems, the design of wireless base stations will face a series of technical challenges.
In wireless communication, how to eliminate unwanted distortion is very critical. Cheng Weijian, HPA business development manager for Texas Instruments Asia Pacific, pointed out: "Third-order intermodulation distortion (IMD3) is a major design difficulty because it is very close to the desired signal and sometimes lies in the band, which is difficult to filter out. In 2G systems, the interference between signals can be removed by simple low-pass filtering or band-pass filtering. In 3G / 4G (LTE) systems, the spacing between channels is very close, so harmonic interference is difficult to pass through band-pass Filter to filter out. "To solve this problem, TI recently introduced a fully linear, ultra-low distortion fully differential operational amplifier. "It reduces the third-order intermodulation distortion to -107dBc (at 100MHz) for the first time, which is at least 14Db lower than similar competitive amplifiers." Cheng Weijian said, "In addition, this product does not require external resistors, and the small signal bandwidth can reach 2.4GHz, which It is a very high indicator for traditional linear op amps. "
Figure 1: THS770006 can drive a high dynamic coverage ADC at full scale.
TI has been committed to the development of high-speed operational amplifiers since 2005, including applications in wireless base stations and products specifically targeted at low power consumption and programmable. The newly introduced THS770006 can drive high dynamic range ADCs at full scale, achieving 16-bit full-scale accuracy at intermediate frequency (IF) up to 200MHz.
Weijian Cheng explained, "An important part of the design of the signal chain is to achieve good attenuation or distortion indicators. Choosing the right 16-bit A / D product can maximize the efficiency of the signal chain, and the use of high-performance operational amplifiers is sufficient. Take advantage of 16-bit A / D performance to enable wireless base stations to achieve the best dynamic range. "The full-scale differential output swing of THS770006 is a key factor in achieving the best performance for ADCs with high dynamic coverage such as ADS5493. With this product, the signal chain quality of wireless communication such as 3G / 4G wireless receivers and multi-carrier GSM, as well as high-speed data acquisition, measurement and testing, and medical imaging can be maximized.
THS770006 has extremely low distortion, high linearity and flat band low voltage noise. The output third-order intercept (OIPS) at 100MHz is 48 dBm, which can help designers meet the sensitivity of advanced modulation schemes (such as LTE, multi-carrier GSM) And bit error rate (BER) requirements. It can seamlessly drive 16-bit high-speed ADCs including TI's latest ADS5493, and supports full-scale 3V peak-to-peak dynamic range to achieve the best flexibility and signal-to-noise ratio.
Figure 2: THS770006 has ultra-low distortion performance.
The THS770006 provides a 7.5ns (maximum) fast overdrive recovery function, which improves the signal integrity of the receiver by minimizing the impact of lost / erroneous data from jammers and blockers. Combined with TI's high-speed signal chain products (such as high-performance multi-core C6000 DSP, ADS5493 and ADS4149 high-speed ADC and CDCE72020 clock solution, etc.), it can accelerate the time to market. Low impedance and voltage mode output can achieve higher gain flatness in the band, which simplifies the design and reduces BOM cost. No external resistors are required to minimize the number of external components.
The THS770006 in a 4mm × 4mm QFN-48 package that supports thermal pads is available now, and its fixed voltage gain is + 6dB. In the future, different gain versions will be launched. Also provided are ADS5493 ADC samples and THS770006EVM evaluation board.
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