Microsemi CorporaTIon (Nasdaq: MSCC), a leading supplier of semiconductor technology products dedicated to helping power management, safety, reliability and high performance, has announced that it will meet the requirements of the US Defense Logistics Agency (DLA) The new Schottky diode product series is suitable for aerospace and defense applications that require high power density and excellent heat dissipation performance (typically 0.2-0.85 C / W). The new diode product uses Microsemi's patented ThinkeyTM package, which has a solid ceramic and metal structure with no bonded leads to improve its reliability.
Dr. Simon Wainwright, Vice President and General Manager of Microsemi High-Reliability Products, said: "Microsemi has decades of experience in designing and providing high-reliability solutions for customers in aerospace and defense applications. One of several innovations developed specifically to meet the stringent requirements of customers in these areas, we will join other DLA-qualified devices and continue to expand the Thinkey Schottky diode product portfolio. "
The new diode product supports high surge characteristics and double-sided cooling. Since no soft solder is used in the device structure, it can prevent the mixing of the solder seal and the mounting solder, and eliminate solder creep and recrystallization during power cycling and high temperature storage. (Re-crystallizaTIon).
Product Specification
(1) 1N6910UTK2 to 1N6912UTK2 product series and 1N6940UTK3 to 1N6942UTK3 product series, anode band (AS), cathode band (CS), in line with the requirements of MIL-PRF-19500 / 723/726
(2) Voltage: 15V, 30V and 45V
(3) Current: 25A (for 1N6910UTK2 to 1N6912UTK2 products) and 150A (for 1N6940UTK3 to 1N6492UTK3 products)
(4) With JAN, TX and TXV DLA quality levels
(5) 9 times lighter than TO254 package
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