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MEMS, Microelectro Mechanical Systems, is a multidisciplinary frontier research field developed on the basis of microelectronics technology. After more than 40 years of development, it has become one of the major scientific and technological fields in the world. It involves many disciplines and technologies such as electronics, mechanics, materials, physics, chemistry, biology, medicine, etc., and has broad application prospects.
MEMS technology leads the future development of sensors
In 2014, the “Outline for the Development of National IC Industry Development†issued by the State Council clearly stated that it is necessary to vigorously develop production lines for special-purpose processes such as MEMS and enhance the comprehensive capability of chip manufacturing; The “National Strategic Emerging Industry Development Plan†clearly proposes to promote the industrialization of MEMS, smart sensors, and new power electronic components and equipment; It is proposed to focus on the development of key devices such as smart sensors and MEMS-based sensors. It can be seen that MEMS technology is one of the leading forces in the future development direction of sensors.
MEMS sensor chip has the characteristics of low cost, low power consumption, small size, high precision and long life. It is the future development direction of sensors, especially in the field of automotive electronics and consumer electronics. According to the data, the global automotive MEMS pressure sensor market in 2014 was about 1.31 billion US dollars. It is estimated that by 2018, the global automotive MEMS pressure sensor usage will reach 970 million, with market sales of 1.69 billion US dollars; 2014 global consumer category The market size of electronic products MEMS pressure sensor is about US$214 million. It is estimated that the usage will reach 1.66 billion by 2018, and the market sales will be 610 million US dollars. The market demand is huge.
Bichuang Technology independently develops MEMS innovation sensor future
Beijing BiChuang Technology Co., Ltd. (hereinafter referred to as “Bichuang Technologyâ€) is a wireless sensor network system solution and MEMS sensor chip provider. In the field of MEMS chip design and manufacturing technology, Bichuang Technology has mastered the whole process of production process, such as design simulation, front flow film, package test and so on. Bichuang Technology has developed the MEMS pressure sensor chip open package technology, and the performance indicators such as accuracy, stability and temperature drift of the MEMS pressure sensor chip have reached the same level in foreign countries.
Since 2012, BCT has relied on years of technology accumulation to conduct research and development of MEMS products, integrate sensitive components with signal processing, calibration, compensation, and microcontrollers to develop intelligent pressure sensor chips and module products. In 2013, Bichuang Technology independently developed the MEMS chip open package technology, and established an automated packaging and test production line to form a MEMS pressure sensor chip production capacity, which was successfully delivered to users. In 2014, BCT Technology successfully developed dozens of module products such as intake pressure, oil pressure and brake pressure in the field of automotive electronics applications, and achieved mass production and sales. In 2015, BCT Technology in consumer electronics In the field of application, the monolithic integrated digital atmospheric pressure sensor chip was successfully developed and mass sales were realized.
At present, Bichuang Technology has independent chip R&D and design capabilities, and can independently design the chip production process layout. In the front-end film production process, Bichuang Technology has mastered lithography, double-sided lithography, deep etching DRIE, and wafer bonding. At the same time, Bichuang Technology independently developed the open package technology and has built a post-package production line. Package testing is an important way to ensure the performance of MEMS chips. Its cost accounts for about 50% of the production cost of the chip. Compared with the production process, the level of packaging and testing also determines the company's competitiveness in the field of MEMS pressure sensor chips. In the production of MEMS modules, Bichuang Technology uses SMT technology to assemble MEMS pressure sensor chips, signal conditioning chips and related electronic components. At the same time, BiChuang Technology adjusts the temperature, linearity, zero offset and sensitivity of the MEMS chip through temperature compensation and digital compensation process to form a module product with high output signal accuracy and excellent linearity.
With the accumulation of technology and technology in the production process of MEMS products, the company will further improve the company's integrated production capacity, effectively reduce product costs and improve product capacity and quality. In the future, with the enhancement of capital strength and sustained and stable R&D investment, Bichuang Technology will gradually develop and expand technology, improve technology level, manufacturing scale and brand image, and bring better and higher quality products to customers. .
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