[High-tech LED reporter | Long Zonghui] In the past three months, Philips has been active, its lighting department will be listed separately next year, and Philips Lumileds will merge with the lamp department to form a new company, which is expected to be born in a year. New companies with sales of 2 billion will rank third in the world. Philips' headlights division is a strong business segment of the company, and the world's first taillights and headlights are developed by it. At present, Philips' lights have reached cooperation with world-renowned manufacturers such as BMW, Mercedes-Benz and Porsche.
From the current driving force of packaging, the cost is still very important. Although the annual packaging price will drop, it is expected that by 2020, the cost of packaging in the whole lamp will remain at 60%. At the same time, the application of lighting manufacturers puts more demands on the packaging.
For the device, the following four points are very important, namely what LED, device structure, phosphor, and packaging method are used. In order to reduce costs, the future of the device must be smaller and smaller, and only then will the material cost become lower and lower. This is why the chip-scale package is hot because it can reduce the material cost by at least 40% to 50%. It is expected that by the end of the year, Philips Lumileds will also launch its own CSP device. For package manufacturers, once the device size becomes smaller, how to over-current, improve light efficiency, and achieve greater luminous flux is a problem, and how to solder it to the PCB.
Medium and low power is also a relatively mature product, especially low-power products are basically the world of mainland manufacturers. At present, 95% of indoor lighting is used in medium power devices, and may increase the share by 2%-3% in the future. What is the next generation of medium power devices? Zhou Lujun, director of marketing for Philips Lumileds Asia, believes that the next-generation mid-power devices must have better light output, better color conversion in a small space, wider light color coverage, more precise color point control, and smaller size. It is already available in Philips Lumileds products. This year's Philips Lumileds' mid-power devices are based on one-ninth of the ultra-degraded files, with better color temperature drift and meet the requirements of high-end applications below the BBL line.
Obviously, in the future packaging industry, because of competition, the bottom line price reduction is unrealistic, and it only makes sense to continuously climb new peaks in technology. In the next 3-4 years, various package types will still coexist for a long time, because each has its own characteristics and application range, of course, lm/$ and light quality are equally important.
Zhou Lujun, Marketing Director, Philips Lumileds Asia
From the current driving force of packaging, the cost is still very important. Although the annual packaging price will drop, it is expected that by 2020, the cost of packaging in the whole lamp will remain at 60%. At the same time, the application of lighting manufacturers puts more demands on the packaging.
For the device, the following four points are very important, namely what LED, device structure, phosphor, and packaging method are used. In order to reduce costs, the future of the device must be smaller and smaller, and only then will the material cost become lower and lower. This is why the chip-scale package is hot because it can reduce the material cost by at least 40% to 50%. It is expected that by the end of the year, Philips Lumileds will also launch its own CSP device. For package manufacturers, once the device size becomes smaller, how to over-current, improve light efficiency, and achieve greater luminous flux is a problem, and how to solder it to the PCB.
Medium and low power is also a relatively mature product, especially low-power products are basically the world of mainland manufacturers. At present, 95% of indoor lighting is used in medium power devices, and may increase the share by 2%-3% in the future. What is the next generation of medium power devices? Zhou Lujun, director of marketing for Philips Lumileds Asia, believes that the next-generation mid-power devices must have better light output, better color conversion in a small space, wider light color coverage, more precise color point control, and smaller size. It is already available in Philips Lumileds products. This year's Philips Lumileds' mid-power devices are based on one-ninth of the ultra-degraded files, with better color temperature drift and meet the requirements of high-end applications below the BBL line.
Obviously, in the future packaging industry, because of competition, the bottom line price reduction is unrealistic, and it only makes sense to continuously climb new peaks in technology. In the next 3-4 years, various package types will still coexist for a long time, because each has its own characteristics and application range, of course, lm/$ and light quality are equally important.
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