Multilayer ceramic capacitor with lead frame

Chip ceramic capacitor
6035 18.432 ceramic

TDK Co., Ltd. (President: Kazuyuki Kazuhiro) developed a new ceramic capacitor, New MEGACAP Type, which supports a high-reliability lead frame with a lead frame for high-reliability applications such as vehicles and base stations, and since July 2013 Started mass production.

In recent years, in the automotive field, electronic control has developed rapidly, and the rate of loading of electronic components has been increasing. In particular, ECUs mounted in extreme temperature environments such as around the engine room are also in a hurry, and the capacitors used therein are required to have high heat resistance and reliability.

In order to meet the above market demand, TDK has been able to use it in a wide temperature range of -55 to +150 °C by reviewing and developing a product structure that uses precision assembly technology and emphasizes heat resistance, vibration resistance and impact resistance. High reliability products for ECU use.

The precision assembly technology newly introduced by this product is a processing technology of an in-vehicle signal line common mode filter (ACT45B series) which is highly evaluated for reliability in the EMC countermeasure components. Therefore, it is possible to realize the shape of the lead frame in the conventional shape (C3225 to C5750), and to realize the shape of the lead frame in the small size (C1608 to C3216) which is difficult to be commercialized in the past, including the C1608 size of the world's smallest* ( The design of MEGACAP has also ensured the improvement of quality and stable supply. At the same time, it also supports larger sizes.

In addition to the EMC countermeasure components and coils (L) that have been well evaluated in the automotive market, TDK will continue to expand the on-board multilayer ceramic capacitors (C) similar to this product. TDK will lead the electronics industry by responding to high reliability and high quality requirements in the passive component market such as L and C.

main application

  • Automotive engine control unit ( ECU )
  • Base station power supply components, etc.
  • Capacitor sounding countermeasures such as PC

Main features and benefits

  • Supports a variety of shapes through precision assembly technology
  • Thermal stress tolerance: suppresses the generation of cracks in capacitors and controls the generation of cracks during package soldering compared to conventional products.
  • Substrate warpage resistance: Strong resistance to warpage of the substrate

Main data

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